Controlling process needs a board in which ingredients are located to sustain communication between device and controller. Design of electronics circuits on the board is an important case. CPU, capacitor and the others, of course, get active with electricity. Location of these ingredients on card are determined based on board area and interaction. While specifying locations of ingredients considering criteria, thermal equilibrium, generally, isn't being considered as a problem that is actually a big problem. There is no censure for anyone who comes from one of electronics departments unless designer familiar with thermal system.
There are various commercial CFD software at which electronics cooling studies might be carried out. Even, Ansys has a particular software regarding to electronics cooling is called as Icepack. If there is no facility to using Icepak, you have to design your own case with others. What are the criteria at which we have to be careful ?
What else ? I advice you to examine project of Simscale that gives you a compatible sight: Click: Simulation Experts Save Electronics from Thermal Damage Click: A project of simscale Also click: MODELING OF NATURAL CONVECTION IN ELECTRONIC ENCLOSURES
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